Drawing die own processing quality factors lead to rapid die wear:.
1. Wire drawing die blank and die steel sleeve inlay asymmetrical, inlay carbide steel sleeve uneven distribution with gap, are easy to lead to die in the wire drawing process to produce u-shaped cracks.
2. Diamond die blanks in the process of laser punching, sintering traces clean up not clean or uneven force will lead to diamond in the drawing process of the mold crater.
3. unreasonable design of die hole type, the entrance lubrication area opening is too small, the sizing band is too long will lead to poor lubrication in the drawing process, resulting in faster die wear and even shattering.
The use of improper factors in the drawing process leads to rapid wear of the mold: 1.
1. The compression rate of the drawing process surface is too large, resulting in cracks or broken molds. The vast majority of cracks or fracture patterns are produced by internal stress release. In any material structure, the existence of internal stress is inevitable, the internal stress generated when drawing wire could have enhanced the microcrystalline structure of the mold, but when the drawing surface compression rate is too large, can not be lubricated in time and thus the temperature rise is too high will lead to the mold surface part of the material is removed, the microcrystalline structure of the stress is greatly increased, making it more likely to produce cracks or broken.
2. The wire stretching axis and die hole centerline is not symmetrical, resulting in uneven stress on the wire and drawing die, while the impact of mechanical vibration will also cause high stress peaks on the wire and drawing die, both of which will accelerate the wear of the die.
3. Because of uneven annealing and lead to uneven hardness of the wire and other factors easily cause diamond wire drawing die premature fatigue loss, resulting in ring grooves to accelerate the wear of the die hole.
4. Wire surface roughness, surface adhesion oxide layer, sand or other impurities, etc. will make the die too fast wear. When the wire through the die hole, hard, brittle oxide layer and other adhering impurities will be like abrasives to cause the wire drawing die hole quickly wear and abrasion wire surface.
5. Poor lubrication or lubricating fluid containing metal debris impurities lead to mold wear. Poor lubrication will make the surface temperature of the die hole rise too fast when drawing, the die grains fall off, resulting in mold damage. When the lubricating fluid is not clean, especially when it contains metal debris shed during drawing, it is very easy to scratch the surface of the die hole and the surface of the wire.
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