In microelectronics semiconductor integrated circuits, large curtain wall glass and automotive rearview mirrors and other technical areas, the need to use different performance, requiring different high purity chromium and chromium alloy sputtering target.
In these products production process, must use a variety of sputtering technology, sputtering single or multi-layer of different materials of metal film, in order to achieve the functional requirements of the product.
With the development of high-tech, the demand for these products is expanding, showing its good application prospects, by the attention and development of the world
As we all know, the processing method is one of the main factors affecting the density of coating target.Chromium target processing methods are mainly hot isostatic pressing, vacuum melting, hot pressing, cold isostatic pressing and sintering, machine pressure and sintering and other methods
Chrome powder sintering unit is sintering, sintering mechanism to spread the main. When the temperature is below 400 ℃, the stress recovery, the adsorption of gas and water evaporation, briquetting dimensions remain essentially unchanged.With the furnace temperature rise, due to the gas in the target blank, resulting in reduced vacuum
When the temperature to 400 ~ 800 ℃, the insulation 1h, began to recrystallize, the particles began to recover the deformation, the formation of new grain, the grain interface gradually due to the gradual bonding, body strength gradually increased.
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