Properties of oxygen-free copper

       Oxygen-free copper:



Pure copper that does not contain oxygen or any deoxidizer residue. But it still contains a very small amount of oxygen and some impurities. According to the standard, the oxygen content is not more than 0.003%, the total impurity content is not more than 0.05%, and the copper purity is more than 99.95%.



Oxygen-free copper products are mainly used in the electronics industry. It is often made into copper materials such as oxygen-free copper plates, oxygen-free copper tapes, and oxygen-free copper wires.



The function of oxygen-free copper



Oxygen-free copper has no hydrogen embrittlement, high conductivity, good processing function, welding function, corrosion resistance function and low temperature function. Generally used in electrical and electronic applications such as audio equipment, vacuum electronic devices, and cables.



Using UP-OCC technology (Ultra Pure Copper by Ohno Continuous Casting Process) made of single crystal oxygen-free copper, non-directional, high purity, anti-corrosion, and extremely low electrical impedance make the wire suitable for high-speed and high-quality signal transmission.



Oxygen-free copper:



Copper has high electrical conductivity and thermal conductivity, excellent weldability, good plasticity and ductility, excellent cold working function and non-magnetic, while dispersed oxygen-free copper overcomes the low yield strength after annealing and high temperature The shortcomings of poor creep resistance, high temperature, high strength and high thermal conductivity, are highly valued by electronic data experts. At present, copper and its alloys have been widely used in the electronics industry. In vacuum electronic devices, oxygen-free copper has ranked first among the seven major structural materials in this field.



Oxygen content is one of the most important functions of oxygen-free copper. Because oxygen and copper have a small solid melting amount, the oxygen in oxygen-free copper actually exists in the form of Cu2O. At high temperatures, hydrogen disperses in copper at a great speed, encounters Cu2O and reduces it, producing a lot of water vapor. The amount of water vapor is the oxygen content of copper. For example, copper with 0.01% oxygen content will form 14cm of water vapor in 100g of copper after annealing. This water vapor cannot be dispersed by fine copper. Therefore, where Cu2O exists, a pressure of several gigapascals will be generated, thus The copper is destroyed, brittle cracks are produced, and the vacuum is lost. Therefore, it is necessary to strictly limit the oxygen content.