Physical vapor deposition is a process such as evaporation, ionization or sputtering, which produces metal particles and reacts with reactive gases to form compounds that are deposited on the surface of the workpiece. There are three kinds of physical vapor deposition methods: vacuum plating, vacuum sputtering and ion plating. At present, ion plating is widely used.
Physical vapor deposition technology means that under vacuum conditions, using physical methods, the surface of a solid or liquid is vaporized into gaseous atoms, molecules or partially ionized into ions, which collide with each other and produce various reactions, and the deposition on the surface of the substrate has some special characteristics. Functional thin film technology.
Physical vapor deposition coating materials are very wide, which can be plated with various metals, alloys, oxides, nitrides, carbides and other compound coatings, and can also be plated with multi-layer or composite layers of metals and compounds, with strong coating adhesion and low process temperature. , The workpiece generally has no problems such as thermal deformation or material deterioration, and the coating has high purity and dense structure. The process is mainly controlled by electrical parameters, which is easy to control and adjust, and has no pollution to the environment.
Physical vapor deposition technology is currently widely used in cutting tools, molds, architectural decoration, special thin film materials, electrical and medical fields.
